www.uccs.edu/~tchriste/courses/PHYS549/549lectures/sputtertech.html
DC sputtering. simplest - basically what we have talked about so far. schematic of DC sputtering. Parameters: Argon Pressure. deposition rate vs. argon pressure ...
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digitalcommons.unl.edu/cgi/viewcontent.cgi?article=1046&context=physicsliou
Oct 12, 2006 ... "Sputtering pressure effect on microstructure of surface and interface, and on coercivity of Co/Pt multilayers" (1991). Si-Hwang Liou ...
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people.rit.edu/lffeee/PVD_Recipes.pdf
Sputtering Pressure: 8 mTorr (Argon flow:15 sccm). ¡ì Deposition Time: 380 Seconds to get 1000? Thickness. ¡ì Thickness standard deviation 4% (30 ?) ...
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en.wikipedia.org/wiki/Sputter_deposition
The entire range from high-energy ballistic impact to low-energy thermalized motion is accessible by changing the background gas pressure. The sputtering gas ...
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www.wfu.edu/~ucerkb/Nan242/L07-Sputtering_a.pdf
Deposition Rate. ? It is proportional to the sputtering yield. ? An optimum pressure exists for high deposition rates. ¨C Higher pressure means more collisions and ...
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groups.mrl.uiuc.edu/dvh/pdf/SFSsputter316.doc
The change from atmospheric pressure to the low pressure in the sputtering chamber is effected in two steps (5 & 6). 5) First, the butterfly valve is opened as ...
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www.ysxbcn.com/downPage.asp?softID=1837&urlID=2468
Influence of sputtering pressure and annealing temperature on surface characteristics, microstructure and optical property of Ta2O5 thin films were investigated.
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ieeexplore.ieee.org/iel1/20/3040/00092242.pdf?arnumber=92242
low sputtering pressure have high Kerr rotation and reflectivity. Also, the Kerr hysteresis-loop square- ness decreases and %ilantness" (AH@,), increases ...
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www.lesker.com/LeskerTech/Archives/0G11M3H/LeskerTech_V7_I1.pdf
Sputter Gas Pressure. Lowering the sputter gas pressure causes a modest increase in deposition rate by a two-fold mechanism: ? Sputtered atoms leaving the ...
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home.icpf.cas.cz/podrazky/Share/sct173.pdf
The effect of oxygen admixture to sputtering gas, sputtering pressure (4.5=10 ... The increase in sputtering pressure has less effect on growth rate, changes the ... |