Perkin-Elmer PE 4480 Sputtering Systems 

We have been focusing on providing solutions and enhancements to Perkin-Elmer Sputtering Systems including Perkin-Elmer PE 4400, PE 4410, PE 4450, PE 4480, PE 2400 Series. These OEM Sputter Coating systems have been used in production and R&D since 1980"s and 1990's. They have been proven to be a true "work horse".

Please contact us by e-mail ( [email protected] ) to check whether the fully refurbished and upgraded Perkin-ELmer PE 4480 Sputter Deposition is available.

Perkin-Elmer Sputtering Deposition Download Information PDFWORD

Versatile Systems For Any Sputtering Need

The Perkin-ELmer 4400 Series Sputter Deposition Systems, designed specially for high throughput production environments, features a high capacity load lock and a broad range of operating models to accommodate virtually any thin film coating requirement.

n      High Throughput

The 4400 Series fast cycle load lock, cryogenic pump, and full flood Meissner trap ensures quick turnaround on batch loads. High throughput are achieved for a full range of substrate sizes and shapes.

n      High Yield

A rotating substrate table for multi-pass deposition helps assure high uniformity and run-to-run repeatability. Simplicity of mechanical design with a minimum number of moving parts in the process chamber minimizes the generation of defect-causing. Easy loading pallet designs reduce wafer breakage. Consistently clean vacuum conditions assure reproducible high quality films.

n      Optimum Process Control

The 4400 Series provides a broad choice of target materials, machine operating models, pressure and gas controls, cathode configurations and power levels. Operating models include DC magnetron, RF magnetron, RF diode, bias sputter, reactive sputter, co-sputter and RF etch.

n      Total Control of Critical Film Characteristics

The 4400 Series systems yield excellent films for a wide variety of materials including aluminum alloys, platinum silicide, titanium-tungsten, nichrome-gold, silicon nitride, silicon dioxide, precious metals and permalloy.

Deposition Of Thin Film for VLSI Geometries

4400 Series System configurations

No single cathode design can effectively meet the varied needs of different users or even the possible multiple needs of one user. Every film requires an optimum combination of target material, size, and shape for its most efficient fabrication. Recognizing these realities, the 4400 Series provides two distinct cathode configurations: 8" circular and delta-shaped.

n      4400

A general purpose sputtering system employing up to three 8" diameter circular cathodes in DC magnetron, RF magnetron, or RF diode configurations. Power options are available up to 2 kw RF and 5 kw DC.

n      4410

A delta target sputtering system designed for high rate deposition of metals and metal alloys. The 4410 is also adaptable to the deposition of dielectrics and employs up to three delta-shaped cathodes in DC magnetron, RF magnetron, or RF diode configuration. Power options are available up to 3 kw RF and 10 KW DC.

n      4450

A delta target sputtering system, similar to the Model 4410 with load lock pumping and heating incorporated as standard features.

n      4480

A delta target sputtering system of identical design to Model 4450 but including cassette-to-cassette loading as a standard feature.