AccuSputter AW 4450 Sputtering Deposition Systems-Brand New 

 We rebuild brand new AccuSputter AW 4450 Series Sputtering Systems with our comparable integrated process control system with PC, new electronic components to achieve the goal of giving our customers a production edge with right cost.

AccuSputter AW 4450 Sputtering System Highlights:

• NEW Aadvanced Control System including Touch screen, Computer, proprietary software package AW 4450 with GUI
• NEW Password control for various levels of user access.
• NEW Manual, Semi-Automatic and Full-Automatic one button system operation.
• NEWCustomer programming of recipe for process parameters.
• NEW Process parameters recorded on system computer.
• NEW Optional GEM/SECS II functions.
• NEW 24V DC control components instead of orginal 110V AC control system
• NEW DC gear motors with encoder to run table rotate/table up&down
• NEW DC gear motors run shutters/pallet carriage moving
• NEW Vacuum gauge/vacuum control system
• NEW Gas control system
• NEW RF automatically matching network
• NEW DC power/RF generator are mounted in the frame
• NEW Plumbing system
• NEW Cables/wires harness
• High rate delta DC magnetron sputtering: Aluminum and aluminum alloys can be sputter deposited at rates in excess of 1800 ? /min, with loads of thirty 3-inch or thirteen 4-inch wafers.
• High throughput operation: Automated load lock and controller sequences provide for efficient pump-down and pallet transfer to process chamber, maximizing throughput.
• High uniformity: +/-7% deposition uniformity guaranteed with water-cooled rotating annular substrate table;+/-5% achievable.
• The right sputter mode for each application: Sputter deposit, DC delta magnetron. Optional: RF bias sputter. DC bias sputter, Puse-DC,sputter etch, RF magnetron, RF diode.
• Ultra-clean vacuum: Cryopump and Meissner-trapped process chamber ensures contamination-free conditions especially important for critical processes.
• Designed for operator safety: Two-button operation initiates pump-down and load sequence. Safety interlocks on DC and RF suppliers.
• Easy maintenance: New designed removable deposition shields permits easy system cleaning. Automatic cryopump regeneration minimized downtime and inconvenience.
• Easy wafer loading: Tweezer grooves facilitate wafer loading. Nested pallets are optional.
• A fail-safe system: Water flow switches on cathodes, matching network and vacuum system automatically shut the system down in case of cooling system failure

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