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www.engr.sjsu.edu/sgleixner/mate129/.../Deposition/sputtering.pdf File Format: PDF/Adobe Acrobat Ar+. Ar+. 2. The Ar+ ions knock Al atoms off the target. The Al lands on the wafer (and everywhere else). San Jose State University: MatE 129. Why Sputtering (vs ...
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users.ece.gatech.edu/~alan/.../ECE6450L12-Physical%20Deposition.... File Format: PDF/Adobe Acrobat - Quick Viewthe target, the argon has achieved high enough energy to sputter the Al and Cu evenly. However, in the gas (lower electric field), the heavier atoms are less ...
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141.213.232.243/bitstream/2027.42/.../2/JAPIAU-85-2-876-1.pdf File Format: PDF/Adobe Acrobat - Quick Viewby AE Lita - 1999 - Cited by 54 - Related articlesCharacterization of surface structure in sputtered Al films: Correlation to microstructure evolution. Adriana E. Lita and John E. Sanchez, Jr.a). Department of ...
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www.oxfordplasma.de/process/sput_sc.htm The SEMs show Al deposited on 1 : 1 and 2 : 1 aspect ratio Si lines. There is a continuous metal film on the walls, even into the notch at the bottom corners !
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